? semiconductor components industries, llc, 2009 july, 2009 ? rev. 12 1 publication order number: ncp562/d ncp562, ncp563 80 ma cmos low iq low-dropout voltage regulator this series of fixed output low ? dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. this series features an ultra ? low quiescent current of 2.5 a. each device contains a voltage reference unit, an error amplifier, a pmos power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. the ncp562 series provides an enable pin for on/off control. the ncp562/ncp563 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 f. the device is housed in the micro ? miniature sc82 ? ab surface mount package. standard voltage versions are 1.5, 1.8, 2.1, 2.5, 2.7, 2.8, 3.0, 3.3, 3.5 and 5.0 v. other voltages are available in 100 mv steps. features ? low quiescent current of 2.5 a typical ? low output voltage option ? output voltage accuracy of 2.0% ? temperature range of ? 40 c to 85 c ? ncp562 provides an enable pin ? pb ? free packages are available typical applications ? battery powered instruments ? hand ? held instruments ? camcorders and cameras figure 1. ncp562 typical application diagram this device contains 28 active transistors output c2 + input gnd enable v in v out + c1 off on figure 2. ncp563 typical application diagram this device contains 28 active transistors output c2 + input gnd n/c v in v out + c1 see detailed ordering and shipping information in the package dimensions section on p age 7 of this data sheet. ordering information sc82 ? ab (sc70 ? 4) sq suffix case 419c 1 4 pin connections & marking diagrams gnd (ncp562 top view) 1 2 4 3 v in enable v out xxxm gnd 1 2 4 3 v in n/c v out (ncp563 top view) http://onsemi.com xxx = specific device code m = month code* = pb ? free package xxxm (note: microdot may be in either location) *date code orientation and/or position and underbar may vary depending upon manu- facturing location.
ncp562, ncp563 http://onsemi.com 2 1 ? enable ? power standby. when this input is pulled low, the device is disabled. if this function is not used, enable should be connected to vin. ? 4 maximum ratings rating symbol value unit input voltage ? 0.3 to v in +0.3 ? 0.3 to v in +0.3 ? to ? ambient ja c/w operating junction temperature t j +150 c ? 40 to +85 c ? 55 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. this device series contains esd protection and exceeds the following tests: human body model 2000 v per mil ? std ? 883, method 3015 machine model method 200 v 2. latch up capability (85 c) 100 ma dc with trigger voltage.
ncp562, ncp563 http://onsemi.com 3 electrical characteristics (v in = v out(nom.) + 1.0 v, v enable = v in , c in = 1.0 f, c out = 1.0 f, t j = 25 c, unless otherwise noted.) characteristic symbol min typ max unit output voltage (t a = 25 c, i out = 1.0 ma) 1.5 v 1.8 v 2.1 v 2.5 v 2.7 v 2.8 v 3.0 v 3.3 v 3.5 v 5.0 v v out 1.455 1.746 2.037 2.425 2.646 2.744 2.940 3.234 3.43 4.9 1.5 1.8 2.1 2.5 2.7 2.8 3.0 3.3 3.5 5.0 1.545 1.854 2.163 2.575 2.754 2.856 3.060 3.366 3.57 5.1 v line regulation 1.5 v ? 4.4 v (v in = v o(nom.) + 1.0 v to 6.0 v 4.5 v ? 5.0 v (v in = 5.5 v to 6.0 v) reg line ? ? 10 10 20 20 mv load regulation (i out = 10 ma to 80 ma) reg load ? 20 40 mv output current (v out = (v out at i out = 80 ma) ? 3.0%) 1.5 v to 3.9 v (v in = v out(nom.) + 2.0 v) 4.0 v ? 5.0 v (v in = 6.0 v) i o(nom.) 80 80 280 280 ? ? ma dropout voltage (t a = ? 40 c to 85 c, i out = 80 ma, measured at v out ? 3.0%) 1.5 v ? 1.7 v 1.8 v ? 2.4 v 2.5 v ? 2.6 v 2.7 v ? 2.9 v 3.0 v ? 3.2 v 3.3 v ? 4.9 v 5.0 v v in ? v out ? ? ? ? ? ? ? 550 400 250 230 200 190 140 800 550 400 400 350 350 250 mv quiescent current (enable input = 0 v) (enable input = v in , i out = 1.0 ma to i o(nom.) ) i q ? ? 0.1 2.5 1.0 6.0 a output short circuit current 1.5 v to 3.9 v (v in = v nom + 2.0 v) 4.0 v ? 5.0 v (v in = 6.0 v) i out(max) 150 150 300 300 600 600 ma output voltage noise (f = 100 hz to 100 khz, v out = 3.0 v) v n ? 100 ? vrms enable input threshold voltage (ncp562 only) (voltage increasing, output turns on, logic high) (voltage decreasing, output turns off, logic low) v th(en) 1.3 ? ? ? ? 0.3 v output voltage temperature coefficient t c ? 100 ? ppm/ c 3. maximum package power dissipation limits must be observed. pd t j(max) t a r ja 4. low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
ncp562, ncp563 http://onsemi.com 4 0 0 v in , input voltage (v) i q , quiescent current ( a) i q , quiescent current ( a) 100 20 0 ? 20 ? 40 ? 60 1.7 2.9 figure 3. quiescent current versus temperature t, temperature ( c) figure 4. quiescent current versus input voltage figure 5. output voltage versus temperature figure 6. output voltage versus input voltage figure 7. dropout voltage versus temperature figure 8. turn ? on response (ncp562 only) 2.7 2.5 6 5 3 2 1 0 0 3 2 1 0.5 v in ? v out , dropout voltage (mv) 125 25 ? 50 t, temperature ( c) 300 4 v out , output voltage (v) 400 250 200 100 50 0 t, time ( s) 1 1.9 2.5 v out , output voltage (v) 100 60 40 20 ? 20 ? 40 ? 60 t, temperature ( c) v out , output voltage (v) 6 1 0 0 3.5 v in , input voltage (v) 3 2.5 2.990 3.020 3.000 2.1 2.3 v in = 4.0 v v out = 3.0 v i out = 0 ma 1.5 v out = 3.0 v 080 2.995 3.015 3.005 3.010 v in = 6.0 v i out = 30 ma v out(nom) = 3.0 v 80 ma load v in = 4.0 v c in = 1.0 f 3 2 2 0 150 40 60 80 4 v in = 4.0 v v out(nom) = 3.0 v i out = 10 ma 2345 2 1.5 1 0.5 ? 25 0 50 75 100 250 200 150 100 50 40 ma load 10 ma load 300 350 c out = 0.1 f i out = 10 ma enable voltage (v)
ncp562, ncp563 http://onsemi.com 5 ? 400 0 figure 9. line transient response figure 10. load transient response 3.5 v n , output voltage noise (mv/ hz ) 100 0 1 0.1 0.01 f, frequency (khz) 0.5 v in = 5.0 v v out = 3.0 v i out = 50 ma c out = 0.1 f 1.5 1 2 2.5 10 100 ? 1 6 output voltage deviation (v) 500 250 200 100 50 0 t, time ( s) ? 0.5 1 0 4 3 150 300 350 v out = 3.0 v c out = 0.1 f i out = 10 ma v in , input voltage (v) 400 450 0.5 5 60 output voltage deviation (v) 500 250 200 100 50 0 t, time ( s) ? 1 0.5 ? 0.5 0 ? 30 150 300 350 i out , output current (ma) 400 450 0 30 1 3 i out = 1 ma to 30 ma v in = 4.0 v v out = 3.0 v c out = 0.1 f 60 600 200 100 500 0 t, time ( s) ? 30 0 0 400 300 700 400 800 ? 200 30 200 i out = 1 ma to 30 ma v in = 4.0 v c out = 1.0 f v out = 3.0 v output voltage deviation (mv) i out , output current (ma) 900 1000 figure 11. load transient response figure 12. output voltage noise definitions load regulation the change in output voltage for a change in output current at a constant temperature. dropout voltage the input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. measured when the output drops 3.0% below its nominal. the junction temperature, load current, and minimum input supply requirements affect the dropout level. maximum power dissipation the maximum total dissipation for which the regulator will operate within its specifications. quiescent current the quiescent current is the current which flows through the ground when the ldo operates without a load on its output: internal ic operation, bias, etc. when the ldo becomes loaded, this term is called the ground current. it is actually the difference between the input current (measured through the ldo input pin) and the output current. line regulation the change in output voltage for a change in input voltage. the measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. line transient response typical over and undershoot response when input voltage is excited with a given slope. thermal protection internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. when activated at typically 160 c, the regulator turns off. this feature is provided to prevent failures from accidental overheating. maximum package power dissipation the maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125 c. depending on the ambient power dissipation and thus the maximum available output current.
ncp562, ncp563 http://onsemi.com 6 applications information a typical application circuit for the ncp562 and ncp563 series are shown in figure 1 and figure 2. input decoupling (c1) a 1.0 f capacitor either ceramic or tantalum is recommended and should be connected close to the ncp562 package. higher values and lower esr will improve the overall line transient response. tdk capacitor: c2012x5r1c105k, or c1608x5r1a105k output decoupling (c2) the ncp562 and ncp563 are very stable regulators and do not require any specific equivalent series resistance (esr) or a minimum output current. capacitors exhibiting esrs ranging from a few m up to 10 can thus safely be used. the minimum decoupling value is 0.1 f and can be augmented to fulfill stringent load transient requirements. the regulator accepts ceramic chip capacitors as well as tantalum devices. larger values improve noise rejection and load regulation transient response. tdk capacitor: c2012x5r1c105k, c1608x5r1a105k, or c3216x7r1c105k enable operation (ncp562 only) the enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. these limits of threshold are covered in the electrical specification section of this data sheet. if the enable is not used, then the pin should be connected to v in . hints please be sure the vin and gnd lines are sufficiently wide. when the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. place external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. thermal as power across the ncp562 and ncp563 increases, it might become necessary to provide some thermal relief. the maximum power dissipation supported by the device is dependent upon board design and layout. mounting pad configuration on the pcb, the board material and also the ambient temperature effect the rate of temperature rise for the part. this is stating that when the devices have good thermal conductivity through the pcb, the junction temperature will be relatively low with high power dissipation applications. the maximum dissipation the package can handle is given by: pd t j(max) t a r ja if junction temperature is not allowed above the maximum 125 c, then the ncp562 and ncp563 can dissipate up to 250 mw @ 25 c. the power dissipated by the ncp562 and ncp563 can be calculated from the following equation: p tot v in *i gnd (i out ) [ v in v out ] *i out or v inmax p tot v out * i out i gnd i out if an 80 ma output current is needed then the ground current from the data sheet is 2.5 a. for an ncp562 or ncp563 (3.0 v), the maximum input voltage will then be 6.0 v.
ncp562, ncp563 http://onsemi.com 7 ordering information device nominal output voltage marking package shipping ? ncp562sq15t1g 1.5 ldi sc82 ? ab 3000 / tape & reel ncp562sq18t1g 1.8 ley ncp562sq21t1g 2.1 aaa ncp562sq25t1g 2.5 ldk ncp562sq27t1g 2.7 lez ncp562sq28t1g 2.8 ldl ncp562sq30t1g 3.0 ldm ncp562sq33t1 3.3 ldn ncp562sq33t1g NCP562SQ35T1G 3.5 lju ncp562sq50t1g 5.0 ldp ncp563sq15t1 1.5 ldq ncp563sq15t1g ncp563sq18t1 1.8 lfa ncp563sq18t1g ncp563sq25t1 2.5 lds ncp563sq25t1g ncp563sq27t1 2.7 lfb ncp563sq27t1g ncp563sq28t1 2.8 ldt ncp563sq28t1g ncp563sq30t1 3.0 ldu ncp563sq30t1g ncp563sq33t1 3.3 ldv ncp563sq33t1g ncp563sq50t1 5.0 ldx ncp563sq50t1g ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
ncp562, ncp563 http://onsemi.com 8 package dimensions sc ? 82ab case 419c ? 02 issue e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. 419c ? 01 obsolete. new standard is 419c ? 02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. 12 3 a g s n j k 4 d 3 pl b f l c h 0.05 (0.002) dim min max min max inches millimeters a 1.8 2.2 0.071 0.087 b 1.15 1.35 0.045 0.053 c 0.8 1.1 0.031 0.043 d 0.2 0.4 0.008 0.016 f 0.3 0.5 0.012 0.020 g 1.1 1.5 0.043 0.059 h 0.0 0.1 0.000 0.004 j 0.10 0.26 0.004 0.010 k 0.1 ??? 0.004 ??? l 0.05 bsc 0.002 bsc n 0.2 ref 0.008 ref s 1.8 2.4 0.07 0.09 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1.30 0.0512 mm inches scale 10:1 0.65 0.026 1.90 0.075 0.90 0.035 0.70 0.028 0.95 0.037 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 ncp562/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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